Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
Xiuyi Zhou, Jun Yang 0002, Yi Xu, Youtao Zhang, Ji...
Abstract. In this paper we describe a novel concept for reliability analysis of communication architectures in safety-critical systems. This concept has been motivated by applicati...
As technology scales and the energy of computation continually approaches thermal equilibrium [1,2], parameter variations and noise levels will lead to larger error rates at vario...
A parallel computing approach for large-scale SPICE-accurate circuit simulation is described that is based on a new preconditioned iterative solver. The preconditioner involves the...
Heidi Thornquist, Eric R. Keiter, Robert J. Hoekst...
New technologies have recently emerged to challenge the very nature of computing: multicore processors, virtualized operating systems and networks, and data-center clouds. One can...