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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
16 years 16 days ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
135
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ICC
2007
IEEE
165views Communications» more  ICC 2007»
15 years 10 months ago
Oblivious Keyword Search Protocols in the Public Database Model
— Databases associated with keywords, can be public, private or hybrid, as a result the solutions to keyword search protocols for each type are different. In this paper, we study...
Huafei Zhu, Feng Bao