As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
: Service-oriented architectures (SOA) are recent architectures enabling interoperable machine-to-machine process interaction by generating a comprehensive view of independent soft...
The Internet’s routing system is facing stresses due to its poor fundamental scaling properties. Compact routing is a research field that studies fundamental limits of routing ...
Dmitri V. Krioukov, Kimberly C. Claffy, Kevin R. F...
Many embedded systems contain resource constrained microcontrollers where applications, operating system components and device drivers reside within a single address space with no...
Ram Kumar, Akhilesh Singhania, Andrew Castner, Edd...
With the development of inexpensive storage devices, space usage is no longer a bottleneck for computer users. However, the increasingly large amount of personal information poses ...