828 search results - page 153 / 166 » Modeling of Workload in MPPs |
DAC
2009
ACM
14 years 10 months ago
2009
ACM
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
WWW
2003
ACM
14 years 10 months ago
2003
ACM
In the light of image retrieval evolving from text annotation to content-based and from standalone applications to web-based search engines, we foresee the need for deploying cont...
HPCA
2009
IEEE
14 years 10 months ago
2009
IEEE
The shrinking processor feature size, lower threshold voltage and increasing clock frequency make modern processors highly vulnerable to transient faults. Architectural Vulnerabil...
KDD
2009
ACM
14 years 10 months ago
2009
ACM
Various online social networks (OSNs) have been developed rapidly on the Internet. Researchers have analyzed different properties of such OSNs, mainly focusing on the formation an...
HPCA
2008
IEEE
14 years 10 months ago
2008
IEEE
Estimating the maximum power and thermal characteristics of a processor is essential for designing its power delivery system, packaging, cooling, and power/thermal management sche...