We present an efficient technique for finding the mean and variance of the full-chip leakage of a candidate design, while considering logic-structures and both die-to-die and with...
In the flip-chip assembly process, no-flow underfill materials have a particular advantage over traditional underfill: the application and curing of the former can be undertaken b...
Hua Lu 0003, K. C. Hung, Stoyan Stoyanov, Chris Ba...
Consumer electronics products, such as high-end (digital) TVs, contain complex systems on chip (SOC) that offer high computational performance at low cost. Traditionally, these SO...
Networks on chip (NoCs) draw on concepts inherited from distributed systems and computer networks subject areas to interconnect IP cores in a structured and scalable way. Congesti...
We propose a packet switched platform for single chip systems which scales well to an arbitrary number of processor like resources. The platform, which we call Network-on-Chip (NO...
Shashi Kumar, Axel Jantsch, Mikael Millberg, Johnn...