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CODES
2007
IEEE
14 years 2 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
ISCA
2008
IEEE
137views Hardware» more  ISCA 2008»
14 years 2 months ago
Self-Optimizing Memory Controllers: A Reinforcement Learning Approach
Efficiently utilizing off-chip DRAM bandwidth is a critical issue in designing cost-effective, high-performance chip multiprocessors (CMPs). Conventional memory controllers deli...
Engin Ipek, Onur Mutlu, José F. Martí...
ISLPED
2009
ACM
123views Hardware» more  ISLPED 2009»
14 years 1 months ago
Predict and act: dynamic thermal management for multi-core processors
In this paper, we propose a proactive dynamic thermal management scheme for chip multiprocessors that run multi-threaded workloads. We introduce a new predictor that utilizes the ...
Raid Zuhair Ayoub, Tajana Simunic Rosing
RSP
2007
IEEE
143views Control Systems» more  RSP 2007»
14 years 2 months ago
Heuristics for Dynamic Task Mapping in NoC-based Heterogeneous MPSoCs
Multiprocessor Systems-on-Chip (MPSoCs) is a trend in VLSI design, since they minimize the “design crisis” (gap between silicon technology and actual SoC design capacity) and ...
Ewerson Carvalho, Ney Calazans, Fernando Moraes