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MICRO
2006
IEEE
144views Hardware» more  MICRO 2006»
14 years 1 months ago
Die Stacking (3D) Microarchitecture
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
SAB
2010
Springer
147views Optimization» more  SAB 2010»
13 years 6 months ago
Fractal Gene Regulatory Networks for Robust Locomotion Control of Modular Robots
Designing controllers for modular robots is difficult due to the distributed and dynamic nature of the robots. In this paper fractal gene regulatory networks are evolved to control...
Payam Zahadat, David Johan Christensen, Ulrik Pagh...
EUROSYS
2010
ACM
14 years 4 months ago
A Comprehensive Scheduler for Asymmetric Multicore Systems
Symmetric-ISA (instruction set architecture) asymmetricperformance multicore processors were shown to deliver higher performance per watt and area for codes with diverse architect...
Juan Carlos Saez, Manuel Prieto Matias, Alexandra ...
IADIS
2004
13 years 9 months ago
A Scalable I/O Architecture and File System for Internet Servers
Most Internet services rely on the traditional client-server model, where the quality of services usually depends on the performance of those servers. In this paper, we propose a ...
Chei-Yol Kim, Sung-Hoon Sohn, Baik-Song Ahn, Gyu-I...
NCA
2009
IEEE
14 years 2 months ago
Analysis of Round-Robin Implementations of Processor Sharing, Including Overhead
—It has been observed in recent years that in many applications service time demands are highly variable. Without foreknowledge of exact service times of individual jobs, process...
Steve Thompson, Lester Lipsky, Sarah Tasneem, Feng...