3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
Designing controllers for modular robots is difficult due to the distributed and dynamic nature of the robots. In this paper fractal gene regulatory networks are evolved to control...
Payam Zahadat, David Johan Christensen, Ulrik Pagh...
Symmetric-ISA (instruction set architecture) asymmetricperformance multicore processors were shown to deliver higher performance per watt and area for codes with diverse architect...
Juan Carlos Saez, Manuel Prieto Matias, Alexandra ...
Most Internet services rely on the traditional client-server model, where the quality of services usually depends on the performance of those servers. In this paper, we propose a ...
Chei-Yol Kim, Sung-Hoon Sohn, Baik-Song Ahn, Gyu-I...
—It has been observed in recent years that in many applications service time demands are highly variable. Without foreknowledge of exact service times of individual jobs, process...
Steve Thompson, Lester Lipsky, Sarah Tasneem, Feng...