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SLIP
2009
ACM
14 years 3 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
VLDB
2002
ACM
143views Database» more  VLDB 2002»
13 years 8 months ago
SQL Memory Management in Oracle9i
Complex database queries require the use of memory-intensive operators like sort and hashjoin. Those operators need memory, also referred to as SQL memory, to process their input ...
Benoît Dageville, Mohamed Zaït
ICIP
2008
IEEE
14 years 10 months ago
A scalable complexity specification for video applications
We propose a new complexity modeling framework for multimedia tasks. We characterize the traffic with five parameters that together we designate as a task's complexity specif...
Nicholas Mastronarde, Mihaela van der Schaar
ICRA
2008
IEEE
216views Robotics» more  ICRA 2008»
14 years 3 months ago
Active robot calibration algorithm
— This paper presents a new updating algorithm to reduce the complexity of computing an observability index for kinematic calibration of robots. An active calibration algorithm i...
Yu Sun, John M. Hollerbach
DATE
2003
IEEE
114views Hardware» more  DATE 2003»
14 years 2 months ago
Extraction of Piecewise-Linear Analog Circuit Models from Trained Neural Networks Using Hidden Neuron Clustering
This paper presents a new technique for automatically creating analog circuit models. The method extracts - from trained neural networks - piecewise linear models expressing the l...
Simona Doboli, Gaurav Gothoskar, Alex Doboli