3D integration of multiple active layers into a single chip is a viable technique that greatly reduces the length of global wires by providing vertical connections between layers....
Mosin Mondal, Andrew J. Ricketts, Sami Kirolos, Ta...
: With technology scaling, elevated temperatures caused by increased power density create a critical bottleneck modulating the circuit operation. With the advent of FinFET technolo...
While evidence indicates that neural systems may be employing sparse approximations to represent sensed stimuli, the mechanisms underlying this ability are not understood. We desc...
Christopher J. Rozell, Don H. Johnson, Richard G. ...
Dynamic power is the main source of power consumption in CMOS circuits. It depends on the square of the supply voltage. It may significantly be reduced by scaling down the supply ...
Noureddine Chabini, El Mostapha Aboulhamid, Yvon S...
This paper presents a unifying framework for the modeling of asynchronous pipeline circuits. A pipeline protocol is captured in a graph-based model which defines the partial order...