This paper describes a new design methodology to analyze the on-chip power supply noise for high performance microprocessors. Based on an integrated package-level and chip-level p...
Abstract--Thermal issues are fast becoming major design constraints in high-performance systems. Temperature variations adversely affect system reliability and prompt worst-case de...
Amit Kumar 0002, Li Shang, Li-Shiuan Peh, Niraj K....
—Time-dependent performance degradation due to transistor aging caused by mechanisms such as Negative Bias Temperature Instability (NBTI) and Hot Carrier Injection (HCI) is one o...
Abstract. Many large-scale optimization problems rely on graph theoretic solutions; yet high-performance computing has traditionally focused on regular applications with high degre...
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...