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DAC
1997
ACM
14 years 23 days ago
Power Supply Noise Analysis Methodology for Deep-Submicron VLSI Chip Design
This paper describes a new design methodology to analyze the on-chip power supply noise for high performance microprocessors. Based on an integrated package-level and chip-level p...
Howard H. Chen, David D. Ling
TCAD
2008
167views more  TCAD 2008»
13 years 8 months ago
System-Level Dynamic Thermal Management for High-Performance Microprocessors
Abstract--Thermal issues are fast becoming major design constraints in high-performance systems. Temperature variations adversely affect system reliability and prompt worst-case de...
Amit Kumar 0002, Li Shang, Li-Shiuan Peh, Niraj K....
DATE
2010
IEEE
161views Hardware» more  DATE 2010»
14 years 1 months ago
Aging-resilient design of pipelined architectures using novel detection and correction circuits
—Time-dependent performance degradation due to transistor aging caused by mechanisms such as Negative Bias Temperature Instability (NBTI) and Hot Carrier Injection (HCI) is one o...
Hamed F. Dadgour, Kaustav Banerjee
WEA
2005
Springer
176views Algorithms» more  WEA 2005»
14 years 2 months ago
High-Performance Algorithm Engineering for Large-Scale Graph Problems and Computational Biology
Abstract. Many large-scale optimization problems rely on graph theoretic solutions; yet high-performance computing has traditionally focused on regular applications with high degre...
David A. Bader
ISQED
2002
IEEE
137views Hardware» more  ISQED 2002»
14 years 1 months ago
A Comprehensive Layout Methodology and Layout-Specific Circuit Analyses for Three-Dimensional Integrated Circuits
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
Syed M. Alam, Donald E. Troxel, Carl V. Thompson