I/O placement has always been a concern in modern IC design. Due to flip-chip technology, I/O can be placed throughout the whole chip without long wires from the periphery of the...
Hung-Ming Chen, I-Min Liu, Martin D. F. Wong, Muzh...
As we scale down to deep submicron (DSM) technology, noise is becoming a metric of equal importance as power, speed, and area. Smaller feature sizes, low voltage, and high frequen...
Critical issues in designing a high speed, low power static RAM in deep submicron technologies are described along with the design techniques used to overcome them. With appropria...