196 search results - page 29 / 40 » On Isolating Points Using Disks |
3DIC
2009
IEEE
14 years 2 months ago
2009
IEEE
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
ISCC
2008
IEEE
14 years 2 months ago
2008
IEEE
We evaluate the capacity of an IEEE 802.16d and IEEE 802.11g testbed to simultaneously carry emulated H.264/AVC video and Speex VoIP and present results from an extensive measurem...
IWIA
2005
IEEE
14 years 1 months ago
2005
IEEE
This paper1 describes survivability schemes against Access Point (AP) failures in Wireless LANs. It particularly aims for resiliency and survivability against multistage attacks w...
MSS
2005
IEEE
14 years 1 months ago
2005
IEEE
We present a policy-based architecture STEPS for lifecycle management (LCM) in a mass scale distributed file system. The STEPS architecture is designed in the context of IBM’s ...
ICDAR
2003
IEEE
14 years 27 days ago
2003
IEEE
To take care of variability involved in the writing style of different individuals in this paper we propose a robust scheme to segment unconstrained handwritten Bangla texts into ...