Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
Samson Melamed, Thorlindur Thorolfsson, Adi Sriniv...
Pre-fabrication design verification and post-fabrication chip testing are two important stages in the product realization process. These two stages consume a large part of resourc...
Process mining refers to the extraction of process models from event logs. Real-life processes tend to be less structured and more flexible. Traditional process mining algorithms ...
R. P. Jagadeesh Chandra Bose, Wil M. P. van der Aa...
Abstract. Communication technologies, such as e-mail, instant messaging, discussion forums, blogs, and newsgroups connect people together, forming virtual communities. This concept...
Florian Skopik, Hong Linh Truong, Schahram Dustdar
Current mesh reduction techniques, while numerous, all primarily reduce mesh size by successive element deletion (e.g. edge collapses) with the goal of geometric and topological f...