—Increasing power density causes die overheating due to limited cooling capacity of the package. Conventional thermal management techniques e.g. logic shutdown, clock gating, fre...
In this paper, we propose a low-power approach to the design of embedded very long instruction word (VLIW) processor architectures based on the forwarding (or bypassing) hardware, ...
The reliability of future processors is threatened by decreasing transistor robustness. Current architectures focus on delivering high performance at low cost; lifetime device rel...
Andrea Pellegrini, Joseph L. Greathouse, Valeria B...
Current-generation microprocessors are designed to process instructions with one and two source operands at equal cost. Handling two source operands requires multiple ports for ea...
The issue logic of dynamically scheduled superscalar processors is one of their most complex and power-consuming parts. In this paper we present alternative issue-logic designs th...