—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
deliver objects, handle emergency, wherever he/she is inside the home. In addition, the burden of processing We address issues dealing with distributed visual power can be distribu...
Profiling an application executing on a microprocessor is part of the solution to numerous software and hardware optimization and design automation problems. Most current profilin...
Volunteer distributed computations utilize spare processor cycles of personal computers that are connected to the Internet. The resulting platforms provide computational power pre...
Doug Szajda, Michael Pohl, Jason Owen, Barry G. La...
This paper examines how computation can be mapped across the nodes of a distributed search system to effectively utilize available resources. We specifically address computationa...
Larry Huston, Alex Nizhner, Padmanabhan Pillai, Ra...