3678 search results - page 674 / 736 » On the Stable Paths Problem |
ICCAD
2005
IEEE
14 years 6 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
LCTRTS
2009
Springer
14 years 4 months ago
2009
Springer
Register file (RF) is extremely vulnerable to soft errors, and traditional redundancy based schemes to protect the RF are prohibitive not only because RF is often in the timing c...
GLOBECOM
2009
IEEE
14 years 4 months ago
2009
IEEE
— In this paper, we propose a game theoretic approach to tackle the problem of the distributed formation of the hierarchical network architecture that connects the nodes in the u...
INFOCOM
2009
IEEE
14 years 4 months ago
2009
IEEE
—Enterprise networks are increasingly adopting Layer 3 Multiprotocol Label Switching (MPLS) Virtual Private Network (VPN) technology to connect geographically disparate locations...
AAIM
2009
Springer
14 years 4 months ago
2009
Springer
: © Efficiently Generating k-Best Solutions to Procurement Auctions Andrew Byde, Terence Kelly, Yunhong Zhou, Robert Tarjan HP Laboratories HPL-2009-163 procurement, auctions, dec...