Manufacturing process variability impacts the performance of synchronous logic circuits by means of its effect on both clock network and functional block delays. Typically, varia...
The test time for core-external interconnect shorts/opens is typically much less than that for core-internal logic. Therefore, prior work on test infrastructure design for core-ba...
Continuously shrinking feature sizes result in an increasing susceptibility of circuits to transient faults, e.g. due to environmental radiation. Approaches to implement fault tol...
In the nanometer IC design, dummy fill is often performed to improve layout pattern uniformity and the post-CMP quality. However, filling dummies might greatly increase intercon...
With the circuit density available in today’s ASIC design systems, increased integration is possible creating more complexity in the design of a System on a Chip (SoC). IBM’s ...
C. Ross Ogilvie, Richard Ray, Robert Devins, Mark ...