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ICCAD
2009
IEEE
136views Hardware» more  ICCAD 2009»
13 years 8 months ago
Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
Young-Joon Lee, Rohan Goel, Sung Kyu Lim
MOBIHOC
2008
ACM
14 years 10 months ago
Energy efficient multi-path communication for time-critical applications in underwater sensor networks
Due to the long propagation delay and high error rate of acoustic channels, it is very challenging to provide reliable data transfer for time-critical applications in an energy-ef...
Zhong Zhou, Jun-Hong Cui
MOBIHOC
2002
ACM
14 years 10 months ago
Performance evaluation of a fair backoff algorithm for IEEE 802.11 DFWMAC
Due to hidden terminals and a dynamic topology, contention among stations in an ad-hoc network is not homogeneous. Some stations are at a disadvantage in opportunity of access to ...
Zuyuan Fang, Brahim Bensaou, Yu Wang
EWSN
2010
Springer
14 years 7 months ago
F-LQE: A Fuzzy Link Quality Estimator for Wireless Sensor Networks
Abstract. Radio Link Quality Estimation (LQE) is a fundamental building block for Wireless Sensor Networks, namely for a reliable deployment, resource management and routing. Exist...
Nouha Baccour, Anis Koubaa, Habib Youssef, Maissa ...
ICCD
2006
IEEE
137views Hardware» more  ICCD 2006»
14 years 7 months ago
Implementation and Evaluation of On-Chip Network Architectures
— Driven by the need for higher bandwidth and complexity reduction, off-chip interconnect has evolved from proprietary busses to networked architectures. A similar evolution is o...
Paul Gratz, Changkyu Kim, Robert G. McDonald, Step...