65 search results - page 5 / 13 » Optimal design of high density 802.11 WLANs |
ISLPED
2009
ACM
14 years 1 months ago
2009
ACM
Increasing power densities and the high cost of low thermal resistance packages and cooling solutions make it impractical to design processors for worst-case temperature scenarios...
TCOM
2011
13 years 2 months ago
2011
—Low-density parity-check (LDPC) codes are gaining interest for high data rate applications in both terrestrial and spatial communications. They can be designed and studied throu...
ASPDAC
2009
ACM
14 years 1 days ago
2009
ACM
— In three-dimensional (3D) chips, the amount of supply current per package pin is significantly more than in two-dimensional (2D) designs. Therefore, the power supply noise pro...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
Traditionally, at early design stages, leakage power is associated with the number of transistors in a design. Hence, intuitively an implementation with minimum resource usage wou...
EVOW
2000
Springer
13 years 11 months ago
2000
Springer
Modern VLSI design methodologies and manufacturing technologies are making circuits increasingly fast. The quest for higher circuit performance and integration density stems from f...