Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Placement based on simulated annealing is in dominant use in the FPGA community due to its superior quality of result (QoR). However, given the progression of FPGA device capacity...
Huimin Bian, Andrew C. Ling, Alexander Choong, Jia...
—One approach to prolong the lifetime of a wireless sensor network (WSN) is to deploy some relay nodes to communicate with the sensor nodes, other relay nodes, and the base stati...
Satyajayant Misra, Seung Don Hong, Guoliang Xue, J...
We develop approximation algorithms for the problem of placing replicated data in arbitrary networks, where the nodes may both issue requests for data objects and have capacity fo...
We consider a system of compute and storage resources geographically distributed over a large number of locations connected via a wide-area network. By distributing the resources,...
Moritz Steiner, Bob Gaglianello Gaglianello, Vijay...