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DAC
2011
ACM
12 years 7 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
FPGA
2010
ACM
359views FPGA» more  FPGA 2010»
14 years 4 months ago
Towards scalable placement for FPGAs
Placement based on simulated annealing is in dominant use in the FPGA community due to its superior quality of result (QoR). However, given the progression of FPGA device capacity...
Huimin Bian, Andrew C. Ling, Alexander Choong, Jia...
TON
2010
197views more  TON 2010»
13 years 6 months ago
Constrained relay node placement in wireless sensor networks: formulation and approximations
—One approach to prolong the lifetime of a wireless sensor network (WSN) is to deploy some relay nodes to communicate with the sensor nodes, other relay nodes, and the base stati...
Satyajayant Misra, Seung Don Hong, Guoliang Xue, J...
SIAMCOMP
2008
167views more  SIAMCOMP 2008»
13 years 7 months ago
Approximation Algorithms for Data Placement Problems
We develop approximation algorithms for the problem of placing replicated data in arbitrary networks, where the nodes may both issue requests for data objects and have capacity fo...
Ivan D. Baev, Rajmohan Rajaraman, Chaitanya Swamy
SIGCOMM
2012
ACM
11 years 10 months ago
Network-aware service placement in a distributed cloud environment
We consider a system of compute and storage resources geographically distributed over a large number of locations connected via a wide-area network. By distributing the resources,...
Moritz Steiner, Bob Gaglianello Gaglianello, Vijay...