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ICCAD
2009
IEEE
154views Hardware» more  ICCAD 2009»
13 years 5 months ago
Pad assignment for die-stacking System-in-Package design
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
TCAD
2002
73views more  TCAD 2002»
13 years 7 months ago
System-on-a-chip test scheduling with precedence relationships, preemption, and power constraints
Test scheduling is an important problem in system-on-a-chip (SOC) test automation. Efficient test schedules minimize the overall system test application time, avoid test resource c...
Vikram Iyengar, Krishnendu Chakrabarty
TMI
2010
164views more  TMI 2010»
13 years 2 months ago
Robust Reconstruction of MRSI Data Using a Sparse Spectral Model and High Resolution MRI Priors
We introduce a novel algorithm to address the challenges in magnetic resonance (MR) spectroscopic imaging. In contrast to classical sequential data processing schemes, the proposed...
Ramin Eslami, Mathews Jacob
ICCAD
2009
IEEE
147views Hardware» more  ICCAD 2009»
13 years 5 months ago
SAT-based protein design
Computational protein design can be formulated as an optimization problem, where the objective is to identify the sequence of amino acids that minimizes the energy of a given prot...
Noah Ollikainen, Ellen Sentovich, Carlos Coelho, A...
AIPS
2006
13 years 9 months ago
Planning for PDDL3 - An OCSP Based Approach
Recent research in AI Planning is focused on improving the quality of the generated plans. PDDL3 incorporates hard and soft constraints on goals and the plan trajectory. Plan traj...
Bharat Ranjan Kavuluri, Naresh Babu Saladi, Deepak...