Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
Test scheduling is an important problem in system-on-a-chip (SOC) test automation. Efficient test schedules minimize the overall system test application time, avoid test resource c...
We introduce a novel algorithm to address the challenges in magnetic resonance (MR) spectroscopic imaging. In contrast to classical sequential data processing schemes, the proposed...
Computational protein design can be formulated as an optimization problem, where the objective is to identify the sequence of amino acids that minimizes the energy of a given prot...
Noah Ollikainen, Ellen Sentovich, Carlos Coelho, A...
Recent research in AI Planning is focused on improving the quality of the generated plans. PDDL3 incorporates hard and soft constraints on goals and the plan trajectory. Plan traj...