3 search results - page 1 / 1 » Partition-driven standard cell thermal placement |
119
Voted
ICCAD
2003
IEEE
15 years 11 months ago
2003
IEEE
As the technology node progresses, thermal problems are becoming more prominent especially in the developing technology of three-dimensional (3D) integrated circuits. The thermal ...
111
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ISPD
2003
ACM
15 years 7 months ago
2003
ACM
The thermal problem has been emerged as one of the key issues for next-generation IC design. In this paper, we propose a scheme to achieve better thermal distribution for partitio...
130
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ISVLSI
2008
IEEE
15 years 8 months ago
2008
IEEE
In high-performance VLSI circuits, the on-chip power densities are playing dominant role due to increased scaling of technology, increasing number of components, frequency and ban...