As billion transistor System-on-chips (SoC) become commonplace and design complexity continues to increase, designers are faced with the daunting task of meeting escalating design...
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
Packet classification is crucial for the Internet to provide more value-added services and guaranteed quality of service. Besides hardware-based solutions, many software-based cla...
System-on-chip communication architectures have a significant impact on the performance and power consumption of modern multiprocessor system-on-chips (MPSoCs). However, customiza...
Sudeep Pasricha, Young-Hwan Park, Fadi J. Kurdahi,...
Operator-based programming languages provide an effective development model for large scale stream processing applications. A stream processing application consists of many runtim...
Xiaolan J. Zhang, Sujay Parekh, Bugra Gedik, Henri...