- Although the emerging three-dimensional integration technology can significantly reduce interconnect delay, chip area, and power dissipation in nanometer technologies, its impact...
Jason Cong, Ashok Jagannathan, Yuchun Ma, Glenn Re...
In this work we present the results of a project aimed at assembling an hybrid massively parallel machine, the PQE1 prototype, devoted to the simulation of complex physical models...
Paolo Palazzari, Lidia Arcipiani, Massimo Celino, ...
This paper presents hardware and software mechanisms to enable concurrent direct network access (CDNA) by operating systems running within a virtual machine monitor. In a conventi...
Jeffrey Shafer, David Carr, Aravind Menon, Scott R...
Interconnection networks in Systems-On-Chip begin to have a non-negligible impact on the power consumption of a whole system. This is because of increasing inter-wire capacitances...
As part of a NASA HPCC Grand Challenge project, we are designing and implementing a parallel atmospheric chemical tracer model that will be suitable for use in global simulations....