1033 search results - page 9 / 207 » Power, Performance, and Thermal Management for High-Performa... |
DAC
2007
ACM
14 years 8 months ago
2007
ACM
We propose a design and optimization methodology for high performance and ultra low power digital applications on flexible substrate using Low Temperature Polycrystalline Silicon ...
DAC
1998
ACM
14 years 8 months ago
1998
ACM
Power consumption has become one of the biggest challenges in high-performance microprocessor design. The rapid increase in the complexity and speed of each new CPU generation is ...
EWSN
2012
Springer
12 years 3 months ago
2012
Springer
Abstract. Some have argued that the dichotomy between high-performance operation and low resource utilization is false – an artifact that will soon succumb to Moore’s Law and c...
DAC
2006
ACM
14 years 8 months ago
2006
ACM
With ever-increasing power density and cooling costs in modern high-performance systems, dynamic thermal management (DTM) has emerged as an effective technique for guaranteeing th...
TCAD
2008
13 years 7 months ago
2008
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...