In this paper, we present simulation techniques to estimate the worst-case voltage variation using a RC model for the power distribution network. Pattern independent maximum envel...
Higher levels of integration have led to a generation of integrated circuits for which power dissipation and reliability are major design concerns. In CMOS circuits, both of these ...
We develop a new technique of proving lower bounds for the randomized communication complexity of boolean functions in the multiparty `Number on the Forehead' model. Our meth...
In the last decade, researchers have devoted increasing efforts to reduce the average power consumption in VLSI systems during normal operation mode, while power consumption durin...
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...