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FTEDA
2008
75views more  FTEDA 2008»
13 years 8 months ago
Thermally Aware Design
With greater integration, the power dissipation in integrated circuits has begun to outpace the ability of today's heat sinks to limit the on-chip temperature. As a result, t...
Yong Zhan, Sanjay V. Kumar, Sachin S. Sapatnekar
ECCC
2000
59views more  ECCC 2000»
13 years 8 months ago
A Simple Model for Neural Computation with Firing Rates and Firing Correlations
A simple extension of standard neural network models is introduced which provides a model for neural computations that involve both firing rates and firing correlations. Such an ex...
Wolfgang Maass
VLSID
2010
IEEE
190views VLSI» more  VLSID 2010»
13 years 7 months ago
Rethinking Threshold Voltage Assignment in 3D Multicore Designs
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
Koushik Chakraborty, Sanghamitra Roy
TVCG
2012
182views Hardware» more  TVCG 2012»
11 years 11 months ago
ISP: An Optimal Out-of-Core Image-Set Processing Streaming Architecture for Parallel Heterogeneous Systems
—Image population analysis is the class of statistical methods that plays a central role in understanding the development, evolution and disease of a population. However, these t...
Linh K. Ha, Jens Krüger, João Luiz Dih...
EENERGY
2010
14 years 23 hour ago
Energy saving and network performance: a trade-off approach
Power consumption of the Information and Communication Technology sector (ICT) has recently become a key challenge. In particular, actions to improve energy-efficiency of Internet...
Carla Panarello, Alfio Lombardo, Giovanni Schembra...