Chemical-mechanical polishing (CMP) and other manufacturing steps in very deep submicron VLSI have varying effects on device and interconnect features, depending on local character...
Yu Chen, Andrew B. Kahng, Gabriel Robins, Alexande...
This paper presents a new 3-D subband coding framework that is able to achieve a good balance between high compression performance and channel error resilience. Various data transf...
We investigate the application of genetic algorithms (GAs) for recognizing real two-dimensional (2-D) or three-dimensional (3-D) objects from 2-D intensity images, assuming that th...
George Bebis, Evangelos A. Yfantis, Sushil J. Loui...
Abstract--We propose an approach to accurately detecting twodimensional (2-D) shapes. The cross section of the shape boundary is modeled as a step function. We first derive a one-d...
The problem of optimal sequential decision for individual sequences, relative to a class of competing o -line reference strategies, is studied for general loss functions with memo...
Neri Merhav, Erik Ordentlich, Gadiel Seroussi, Mar...