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134
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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
16 years 18 days ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
145
Voted
WWW
2005
ACM
16 years 4 months ago
An environment for collaborative content acquisition and editing by coordinated ubiquitous devices
Digital content is not only stored by servers on the Internet, but also on various embedded devices belonging to ubiquitous networks. In this paper, we propose a content processin...
Yutaka Kidawara, Tomoyuki Uchiyama, Katsumi Tanaka
148
Voted
GLOBECOM
2007
IEEE
15 years 10 months ago
Joint Congestion Control and Burst Contention Resolution in Optical Burst Switching Networks
Abstract— This paper revisits burst contention resolution problems in optical burst switching (OBS) networks from the viewpoint of network utility maximization. Burst collision o...
Won-Seok Park, Minsu Shin, Hyang-Won Lee, Song Cho...
125
Voted
PEPM
2007
ACM
15 years 9 months ago
Behavioral similarity matching using concrete source code templates in logic queries
Program query languages and pattern-detection techniques are an essential part of program analysis and manipulation systems. Queries and patterns permit the identification of the...
Coen De Roover, Theo D'Hondt, Johan Brichau, Carlo...
142
Voted
FMCAD
2007
Springer
15 years 7 months ago
Boosting Verification by Automatic Tuning of Decision Procedures
Parameterized heuristics abound in computer aided design and verification, and manual tuning of the respective parameters is difficult and time-consuming. Very recent results from ...
Frank Hutter, Domagoj Babic, Holger H. Hoos, Alan ...