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ICCAD
2004
IEEE
88views Hardware» more  ICCAD 2004»
16 years 3 months ago
Interconnect lifetime prediction under dynamic stress for reliability-aware design
Thermal effects are becoming a limiting factor in highperformance circuit design due to the strong temperaturedependence of leakage power, circuit performance, IC package cost and...
Zhijian Lu, Wei Huang, John Lach, Mircea R. Stan, ...
ISPASS
2010
IEEE
16 years 1 months ago
Dynamic program analysis of Microsoft Windows applications
—Software instrumentation is a powerful and flexible technique for analyzing the dynamic behavior of programs. By inserting extra code in an application, it is possible to study...
Alex Skaletsky, Tevi Devor, Nadav Chachmon, Robert...
ICDCN
2010
Springer
16 years 29 days ago
An Intelligent IT Infrastructure for the Future
The proliferation of new modes of communication and collaboration has resulted in an explosion of digital information. To turn this challenge into an opportunity, the IT industry ...
Prith Banerjee
135
Voted
HICSS
2009
IEEE
107views Biometrics» more  HICSS 2009»
16 years 28 days ago
Making it Hard to Lie: Cultural Determinants of Media Choice for Deception
In today’s business environment, deception is commonplace. In hiring situations, successful deception by job candidates can lead to a poor fit between the candidate’s abilitie...
Christopher P. Furner, Joey F. George
178
Voted
DAC
2009
ACM
16 years 28 days ago
Throughput optimal task allocation under thermal constraints for multi-core processors
It is known that temperature gradients and thermal hotspots affect the reliability of microprocessors. Temperature is also an important constraint when maximizing the performance...
Vinay Hanumaiah, Ravishankar Rao, Sarma B. K. Vrud...