83 search results - page 8 / 17 » Reducing power density through activity migration |
ISCA
2006
IEEE
14 years 1 months ago
2006
IEEE
One of the key challenges for high-density servers (e.g., blades) is the increased costs in addressing the power and heat density associated with compaction. Prior approaches have...
SAC
2000
ACM
14 years 1 days ago
2000
ACM
Object-oriented modeling and design is a way of solving problems using models based upon real-world concepts. In this paradigm, the fundamental construct is the object, an entity ...
DAC
2005
ACM
14 years 8 months ago
2005
ACM
- The large magnitude of supply/ground bounces, which arise from power mode transitions in power gating structures, may cause spurious transitions in a circuit. This can result in ...
VLDB
1998
ACM
13 years 12 months ago
1998
ACM
The increasing performance and decreasing cost of processors and memory are causing system intelligence to move into peripherals from the CPU. Storage system designers are using t...
CODES
2007
IEEE
14 years 2 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...