282 search results - page 19 / 57 » Reliability- and process-variation aware design of integrate... |
SLIP
2009
ACM
14 years 3 months ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
FPGA
2009
ACM
14 years 3 months ago
2009
ACM
Via-programmable gate arrays (VPGAs) offer a middle ground between application specific integrated circuits and field programmable gate arrays in terms of flexibility, manufac...
DAC
2004
ACM
14 years 10 months ago
2004
ACM
Current technology trends have led to the growing impact of both inter-die and intra-die process variations on circuit performance. While it is imperative to model parameter varia...
ISLPED
2004
ACM
14 years 2 months ago
2004
ACM
We present a novel temperature/leakage sensor, developed for high-speed, low-power, monitoring of processors and complex VLSI chips. The innovative idea is the use of 4T SRAM cell...
ASPDAC
2012
ACM
12 years 4 months ago
2012
ACM
With technology scaling, integrated circuits behave more unpredictably due to process variation, environmental changes and aging effects. Various variation-aware and adaptive desi...