Long-term reliability of processors in embedded systems is experiencing growing attention since decreasing feature sizes and increasing power consumption have a negative influence...
Klaus Waldschmidt, Jan Haase, Andreas Hofmann, Mar...
In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, timing, performance, cooling costs and leakage power. Conventional thermal managem...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Reliability-aware power management (RAPM) schemes have been recently studied to save energy while preserving system reliability. The existing RAPM schemes, however, provision for ...