With the growing complexity in consumer embedded products, new tendencies forecast heterogeneous Multi-Processor SystemsOn-Chip (MPSoCs) consisting of complex integrated component...
David Atienza, Federico Angiolini, Srinivasan Mura...
One of the major challenges of video game design is to have appropriate difficulty levels for users in order to maximize the entertainment value of the game. Game players may lose...
Chang Yun, Dvijesh Shastri, Ioannis Pavlidis, Zhig...
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
Technology Roadmap for Semiconductors (ITRS) clearly identifies the integration of electrochemical and electrobiological techniques as one of the system-level design challenges tha...
Networking researchers have been using tools like wireshark and tcpdump to sniff packets on physical links that use different types of datalink protocols, e.g. Ethernet or 802.11,...