2778 search results - page 497 / 556 » Reuse Technique in Hardware Design |
ICCAD
2006
IEEE
14 years 5 months ago
2006
IEEE
Increasing power densities in Field Programmable Gate Arrays (FPGAs) have made them susceptible to thermal problems. The advent of platform FPGAs has further exacerbated the probl...
ICCAD
2005
IEEE
14 years 5 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
SOSP
2007
ACM
14 years 5 months ago
2007
ACM
Power management has become increasingly necessary in large-scale datacenters to address costs and limitations in cooling or power delivery. This paper explores how to integrate p...
SOSP
2009
ACM
14 years 5 months ago
2009
ACM
Modern computer systems have been built around the assumption that persistent storage is accessed via a slow, block-based interface. However, new byte-addressable, persistent memo...
WISEC
2009
ACM
14 years 3 months ago
2009
ACM
In wireless sensor networks, it is critical to restrict the network access only to eligible sensor nodes, while messages from outsiders will not be forwarded in the networks. In t...