Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
Amirali Shayan Arani, Xiang Hu, He Peng, Chung-Kua...
A two microphone direction of arrival (DOA) estimation technique for multiple speech sources is developed which exploits speech specific properties, namely sparsity in time-frequ...
This paper presents a novel face representation and recognition approach. The face image is first decomposed by multi-scale and multi-orientation Gabor filters and local binary ...
Zhen Lei, ShengCai Liao, Ran He, Matti Pietikä...
This paper proposes a novel method for analyzing large onchip power delivery networks via a stochastic moment matching (SMM) method. The proposed method extends the existing direc...
A major drawback of the Orthogonal Frequency Division Multiplex (OFDM) principle is the high dynamic range of the transmit signal. The transmit Power Amplifier (PA) and other ele...
Andreas Frotzscher, Peter Zillmann, Gerhard Fettwe...