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» Scale in Chip Interconnect requires Network Technology
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TVLSI
2008
99views more  TVLSI 2008»
13 years 8 months ago
A Design-Specific and Thermally-Aware Methodology for Trading-Off Power and Performance in Leakage-Dominant CMOS Technologies
As CMOS technology scales deeper into the nanometer regime, factors such as leakage power and chip temperature emerge as critically important concerns for high-performance VLSI des...
Sheng-Chih Lin, Kaustav Banerjee
ICCAD
1997
IEEE
86views Hardware» more  ICCAD 1997»
14 years 22 days ago
Interconnect design for deep submicron ICs
Interconnect has become the dominating factor in determining circuit performance and reliability in deep submicron designs. In this embedded tutorial, we first discuss the trends...
Jason Cong, David Zhigang Pan, Lei He, Cheng-Kok K...
DAC
1999
ACM
14 years 25 days ago
On-Chip Inductance Issues in Multiconductor Systems
As the family of Alpha microprocessors continues to scale into more advanced technologies with very high frequency edge rates and multiple layers of interconnect, the issue of cha...
Shannon V. Morton
IWANN
2007
Springer
14 years 2 months ago
Interconnecting VLSI Spiking Neural Networks Using Isochronous Connections
This paper presents a network architecture to interconnect mixed-signal VLSI1 integrate-and-fire neural networks in a way that the timing of the neural network data is preserved. ...
Stefan Philipp, Andreas Grübl, Karlheinz Meie...
ASPDAC
2005
ACM
103views Hardware» more  ASPDAC 2005»
13 years 10 months ago
MAIA: a framework for networks on chip generation and verification
- The increasing complexity of SoCs makes networks on chip (NoC) a promising substitute for busses and dedicated wires interconnection schemes. However, new tools need to be develo...
Luciano Ost, Aline Mello, José Palma, Ferna...