521 search results - page 102 / 105 » Scaling Soft Processor Systems |
CODES
2007
IEEE
14 years 1 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
CODES
2007
IEEE
14 years 1 months ago
2007
IEEE
Multiple wireless technologies are converging to run on personal handhelds. The plethora of communication standards next to the cost issues of deeper submicron processing require ...
MICRO
2006
IEEE
14 years 1 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
ACMMSP
2006
ACM
14 years 1 months ago
2006
ACM
A blossoming paradigm for block-recursive matrix algorithms is presented that, at once, attains excellent performance measured by • time, • TLB misses, • L1 misses, • L2 m...
IPSN
2005
Springer
14 years 1 months ago
2005
Springer
— We present the design of the eXtreme Scale Mote, a new sensor network platform for reliably detecting and classifying, and quickly reporting, rare, random, and ephemeral events...