3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
Mohamed M. Sabry, Ayse Kivilcim Coskun, David Atie...
As reconfigurable computing (RC) platforms are becoming increasingly large-scale and heterogeneous, efficiently scheduling and partitioning applications on these platforms is a gro...
Casey Reardon, Alan D. George, Greg Stitt, Herman ...
In-network sensor query processing systems (ISQPs), or sensor databases, have been developed to acquire, process and aggregate data from wireless sensor networks (WSNs). Because W...
Scalability of architecture, programming model and task control management will be a major challenge for future VLSI systems. In this context, homogeneous MPSOC is a seducing appr...
Nicolas Saint-Jean, Pascal Benoit, Gilles Sassatel...
Commercial Scale-Out is a new research project at IBM Research. Its main goal is to investigate and develop technologies for the use of large scale parallelism in commercial appli...