3 search results - page 1 / 1 » Signal integrity optimization on the pad assignment for high... |
ICCAD
1995
IEEE
13 years 10 months ago
1995
IEEE
Pad assignment with signal integrity optimization is very important for high-speed VLSI design. In this paper, an efficient method is proposed to effectively minimize both simulta...
ICCAD
2009
IEEE
13 years 4 months ago
2009
IEEE
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
ICCAD
2008
IEEE
14 years 1 months ago
2008
IEEE
— The area-I/O flip-chip package provides a high chip-density solution to the demand of more I/O’s in VLSI designs; it can achieve smaller package size, shorter wirelength, an...