558 search results - page 74 / 112 » Sink-insertion for mesh improvement |
HPCA
2009
IEEE
14 years 8 months ago
2009
IEEE
Performance and power consumption of an on-chip interconnect that forms the backbone of Chip Multiprocessors (CMPs), are directly influenced by the underlying network topology. Bo...
CVPR
2005
IEEE
14 years 9 months ago
2005
IEEE
This paper presents a novel 3D deformable surface that we call an active polyhedron. Rooted in surface evolution theory, an active polyhedron is a polyhedral surface whose vertice...
ICC
2007
IEEE
14 years 1 months ago
2007
IEEE
— Users’ demand of seamless connectivity has pushed for the development of alternatives to traditional infrastructure networks. Potential solutions should be low-cost, easily d...
ITNG
2007
IEEE
14 years 1 months ago
2007
IEEE
In networks-on-chip (NoC) designs, delay variations and crosstalk noise have become a serious issue with the continuously shrinking geometry of semiconductor devices and the incre...
LCN
2005
IEEE
14 years 1 months ago
2005
IEEE
The Wireless Channel-oriented Ad-hoc Multi-hop Broadband (W-CHAMB) is a new link layer protocol with the aim of being able to support Quality of Service (QoS) in multi-hop operati...