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» Software, architecture, and participatory design
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DAC
2011
ACM
12 years 8 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
MIDDLEWARE
2004
Springer
14 years 1 months ago
Toward a standard ubiquitous computing framework
This paper surveys a variety of subsystems designed to be the building blocks from which sophisticated infrastructures for ubiquitous computing are assembled. Our experience shows...
Martin Modahl, Bikash Agarwalla, Gregory D. Abowd,...
IWPSE
2003
IEEE
14 years 1 months ago
Using Coordination Contracts for Flexible Adaptation to Changing Business Rules
This paper reports on the use of coordination contracts, presented at the previous two IWPSE workshops, in a project for a credit recovery company. We have designed and implemente...
Michel Wermelinger, Georgios Koutsoukos, Richard A...
ATAL
2006
Springer
14 years 1 days ago
Integrating agent-oriented methodologies with UML-AT
There are many methodological approaches for Agent-Oriented Software Engineering, each one focusing on some features of multi-agent systems, but leaving others underdefined. For t...
Rubén Fuentes, Jorge J. Gómez-Sanz, ...
CASES
2005
ACM
13 years 10 months ago
Optimizing stream programs using linear state space analysis
Digital Signal Processing (DSP) is becoming increasingly widespread in portable devices. Due to harsh constraints on power, latency, and throughput in embedded environments, devel...
Sitij Agrawal, William Thies, Saman P. Amarasinghe