Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
This paper surveys a variety of subsystems designed to be the building blocks from which sophisticated infrastructures for ubiquitous computing are assembled. Our experience shows...
Martin Modahl, Bikash Agarwalla, Gregory D. Abowd,...
This paper reports on the use of coordination contracts, presented at the previous two IWPSE workshops, in a project for a credit recovery company. We have designed and implemente...
Michel Wermelinger, Georgios Koutsoukos, Richard A...
There are many methodological approaches for Agent-Oriented Software Engineering, each one focusing on some features of multi-agent systems, but leaving others underdefined. For t...
Digital Signal Processing (DSP) is becoming increasingly widespread in portable devices. Due to harsh constraints on power, latency, and throughput in embedded environments, devel...
Sitij Agrawal, William Thies, Saman P. Amarasinghe