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DAC
2011
ACM
12 years 8 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
CGO
2006
IEEE
14 years 2 months ago
Exhaustive Optimization Phase Order Space Exploration
The phase-ordering problem is a long standing issue for compiler writers. Most optimizing compilers typically have numerous different code-improving phases, many of which can be a...
Prasad Kulkarni, David B. Whalley, Gary S. Tyson, ...
HIKM
2006
ACM
14 years 2 months ago
Epoch: an ontological framework to support clinical trials management
The increasing complexity of clinical trials has generated an enormous requirement for knowledge and information specification at all stages of the trials, including planning, doc...
Ravi D. Shankar, Susana B. Martins, Martin J. O'Co...
ISPASS
2005
IEEE
14 years 2 months ago
Anatomy and Performance of SSL Processing
A wide spectrum of e-commerce (B2B/B2C), banking, financial trading and other business applications require the exchange of data to be highly secure. The Secure Sockets Layer (SSL...
Li Zhao, Ravi R. Iyer, Srihari Makineni, Laxmi N. ...
PAM
2004
Springer
14 years 1 months ago
Measurements and Laboratory Simulations of the Upper DNS Hierarchy
Given that the global DNS system, especially at the higher root and top-levels, experiences significant query loads, we seek to answer the following questions: (1) How does the ch...
Duane Wessels, Marina Fomenkov, Nevil Brownlee, Ki...