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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
14 years 4 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
AIR
2004
130views more  AIR 2004»
13 years 7 months ago
A Hybrid Framework for Over-Constrained Generalized
Abstract. In this work we study an over-constrained scheduling problem where constraints cannot be relaxed. This problem originates from a local defense agency where activities to ...
Andrew Lim, Brian Rodrigues, Ramesh Thangarajo, Fe...
CONSTRAINTS
2002
111views more  CONSTRAINTS 2002»
13 years 7 months ago
A Constraint-Based Interactive Train Rescheduling Tool
In this paper, we report the design and implementation of a constraint-based interactive train rescheduling tool, a project in collaboration with the International Institute for So...
C. K. Chiu, C. M. Chou, Jimmy Ho-Man Lee, Ho-fung ...
EVOW
2003
Springer
14 years 29 days ago
Search Space Analysis of the Linear Ordering Problem
Abstract. The Linear Ordering Problem (LOP) is an NP-hard combinatorial optimization problem that arises in a variety of applications and several algorithmic approaches to its solu...
Tommaso Schiavinotto, Thomas Stützle
GECCO
2007
Springer
289views Optimization» more  GECCO 2007»
14 years 1 months ago
A discrete particle swarm optimization algorithm for the generalized traveling salesman problem
Dividing the set of nodes into clusters in the well-known traveling salesman problem results in the generalized traveling salesman problem which seeking a tour with minimum cost p...
Mehmet Fatih Tasgetiren, Ponnuthurai N. Suganthan,...