Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Abstract. In this work we study an over-constrained scheduling problem where constraints cannot be relaxed. This problem originates from a local defense agency where activities to ...
Andrew Lim, Brian Rodrigues, Ramesh Thangarajo, Fe...
In this paper, we report the design and implementation of a constraint-based interactive train rescheduling tool, a project in collaboration with the International Institute for So...
C. K. Chiu, C. M. Chou, Jimmy Ho-Man Lee, Ho-fung ...
Abstract. The Linear Ordering Problem (LOP) is an NP-hard combinatorial optimization problem that arises in a variety of applications and several algorithmic approaches to its solu...
Dividing the set of nodes into clusters in the well-known traveling salesman problem results in the generalized traveling salesman problem which seeking a tour with minimum cost p...
Mehmet Fatih Tasgetiren, Ponnuthurai N. Suganthan,...