124 search results - page 13 / 25 » Speed Scaling to Manage Temperature |
CODES
2007
IEEE
14 years 1 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
ICCAD
2003
IEEE
14 years 4 months ago
2003
IEEE
We investigate an integrated approach to fault tolerance and dynamic power management in real-time embedded systems. Fault tolerance is achieved via checkpointing and power manage...
ISPDC
2003
IEEE
14 years 25 days ago
2003
IEEE
— This paper presents a new power management technique integrated into a multithreaded microcontroller with builtin real-time scheduling schemes. Power management is done by hard...
SIES
2007
IEEE
14 years 1 months ago
2007
IEEE
— Though modern operating systems have a capable of controlling the power consumption using the DVFS (Dynamic Voltage and Frequency Scaling) mechanism, it is controlled for some ...
ICCAD
2003
IEEE
14 years 4 months ago
2003
IEEE
Energy consumption is an important performance parameter for portable and wireless embedded systems. However, energy consumption must be carefully balanced with real-time responsi...