With technology advances, the number of cores integrated on a chip and their speed of operation is increasing. This, in turn is leading to a significant increase in chip temperat...
Srinivasan Murali, Almir Mutapcic, David Atienza, ...
As CMOS technology scales into the nanometer regime, power dissipation and associated thermal concerns in high-performance ICs due to on-chip hot-spots and thermal gradients are b...
As power density increases exponentially, run-time regulation of operating temperature by dynamic thermal management becomes imperative. This paper proposes a novel approach to re...
Hang Li, Pu Liu, Zhenyu Qi, Lingling Jin, Wei Wu, ...
A methodology for supporting dynamic voltage scaling (DVS) on commercial FPGAs is described. A logic delay measurement circuit (LDMC) is used to determine the speed of an inverter...
C. T. Chow, L. S. M. Tsui, Philip Heng Wai Leong, ...
Increasing power densities and the high cost of low thermal resistance packages and cooling solutions make it impractical to design processors for worst-case temperature scenarios...
Thidapat Chantem, Xiaobo Sharon Hu, Robert P. Dick