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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
14 years 5 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
ADHOCNOW
2009
Springer
13 years 6 months ago
A Decentralized Approach to Minimum-Energy Broadcasting in Static Ad Hoc Networks
Broadcasting is a commonly used feature in wireless networking, e.g. for file distribution, re-tasking, event notification, or miscellaneous maintenance. Due to the limited resourc...
Christopher Miller, Christian Poellabauer
NOMS
2008
IEEE
14 years 2 months ago
Optimizing request denial and latency in an agent-based VPN architecture
—Agent-based virtual private networks architecture (ABVA) refers to the environment where a third-party provider runs and administers remote access VPN service for organizations ...
Haiyang Qian, Steve Dispensa, Deep Medhi
SIGIR
2011
ACM
12 years 11 months ago
The economics in interactive information retrieval
Searching is inherently an interactive process usually requiring numerous iterations of querying and assessing in order to find the desired amount of relevant information. Essent...
Leif Azzopardi
JOT
2008
105views more  JOT 2008»
13 years 8 months ago
Using Multiple Servers in Concurrent Garbage Collector
Object-oriented programming languages are being widely adopted as one of the most powerful languages due their flexibility and reusability. However, these languages suffer from me...
Ali Ebrahim El Desokey, Amany Sarhan, Seham Moawed