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CODES
2007
IEEE
14 years 1 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
ICEBE
2007
IEEE
14 years 1 months ago
2007
IEEE
In the development process of a B2B system it is crucial that the business experts are able to express and evaluate agreements and commitments between the partners and that the so...
DATE
2006
IEEE
14 years 1 months ago
2006
IEEE
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
ISCC
2006
IEEE
14 years 1 months ago
2006
IEEE
— Even for a specific application, the design space of wireless sensor networks is enormous, and traditional disciplinary boundaries are disappearing in the search for efficien...
ESOP
2005
Springer
14 years 1 months ago
2005
Springer
Are computing systems trustworthy? To answer this, we need to know three things: what the systems are supposed to do, what they are not supposed to do, and what they actually do. A...