We have previously presented Qsilver, a flexible simulation system for graphics architectures. In this paper we describe our extensions to this system, which we use— instrument...
Jeremy W. Sheaffer, Kevin Skadron, David P. Luebke
Technology scaling trends and the limitations of packaging and cooling have intensified the need for thermally efficient architectures and architecture-level temperature managemen...
Eren Kursun, Glenn Reinman, Suleyman Sair, Anahita...
This paper describes the first infrastructure for integrated studies of the performance and thermal behavior of storage systems. Using microbenchmarks running on this infrastructu...
Youngjae Kim, Sudhanva Gurumurthi, Anand Sivasubra...
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
Kevin Skadron, Mircea R. Stan, Wei Huang, Sivakuma...
Multi-Processor System-On-Chip (MPSoC) can provide the performance levels required by high-end embedded applications. However, they do so at the price of an increasing power densi...
Salvatore Carta, Andrea Acquaviva, Pablo Garcia De...