4887 search results - page 116 / 978 » System Level Design Using C |
148
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VLSID
2010
IEEE
15 years 2 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
126
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ICRA
1993
IEEE
15 years 8 months ago
1993
IEEE
Many tasks are di cult or impossible for onearmed" robots, for example, assembly with long parts. Multi-armed robots can do such tasks well, but only if both robot and contro...
146
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HPCA
2000
IEEE
15 years 9 months ago
2000
IEEE
With increasing chip densities, future microprocessor designs have the opportunity to integrate many of the traditional systemlevel modules onto the same chip as the processor. So...
141
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CHI
2008
ACM
16 years 4 months ago
2008
ACM
We present LiveRAC, a visualization system that supports the analysis of large collections of system management timeseries data consisting of hundreds of parameters across thousan...
130
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WICSA
2008
15 years 6 months ago
2008
This paper introduces an architectural style for enabling end-users to quickly design and deploy software systems in domains characterized by highly personalized and dynamic requi...